The EuroPAT-MASiP project with 28 partners from all over Europe was completed in August 2021, demonstrating a successful and significant overall outcome. The project, funded by the ECSEL JU and national funding agencies, aimed to reinforce the European semiconductor manufacturing position by focusing on the semiconductor and microelectromechanical systems (MEMS) packaging. The results of the project have an impact on the development of new packaging technologies, production and test equipment, as well as on innovative applications by European electronics, component and system manufacturers. Spinverse prepared the funding application and during the project execution supported the project coordinator on the successful management of the project.
The Smart Systems Integration Conference 2021 conference takes place April 27th to 29th, 2021 as a virtual event. Being one of the organizers, a EuroPAT-MASIP partner Franhofer ENAS invites you all to participate!
The presentations of Smart Systems Integration Conference will take place on three mornings (27.04. – 29.04.) from 9 – 12 a.m. The experts will present their latest findings in the field of Smart Systems along the whole of the value chain, starting from MEMS/NEMS, photonics, micromechanics, microfluidics, printed functionalities through to complete systems and different application scenarios.
EuroPAT-MASIP had its 3rd review meeting on Wednesday this week, thanks for the reviewers for their positive and encouraging feedback! The remaining six months will be busy with the last deliverables and testings, but it definitely looks like the first results will be exploited commercially very soon after the project ends in June 2021. Exciting times!
Now, happy holidays for everyone and even happier new year 2021!
EuroPAT-MASIP team from Fraunhofer ENAS, Besi NL and Amkor has been awarded with the Outstanding Paper Award at ASME 2020 InterPACK Conference (oct 27-28. 2020) for their paper “The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods” .
Congratulations to Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes and Felandorio Fernandes!
The book includes one chapter (Chapter 33 – Fan-out wafer-level packaging as packaging technology for MEMS) written by EuroPAT-MASIP project members from ATEP, Murata and Fraunhofer IZM.
Having great experts in your team now is an important thing, but so is having them in future: in February 6th, 31 students from University of Minho visited Amkor Technology Portugal (ATEP).
The students were introduced to the state-of-the-art of packaging technology, the projects where ATEP is involved (including EuroPAT-MASIP!) and the project targets.
Thank you for the visit, hopefully we’ll meet again!
The second review meeting of EuroPAT-MASIP was organized in Brussels in the last week of October 2019, and we were proud to present the progress we have made since the first review! We now have prototypes of 3/6 application pilots, and certain partners have also detected new tools and improvements to their processes. We are very excited to see how this new know-how will affect on semiconductor and MEMS manufacturing business during upcoming years.
We are looking forward to tell more about these prototypes and results in a press release in December, so stay tuned!
A well-deserved dinner after the review meeting – thank you for all AP and TLV owners, WP leaders, reviewers and our great project officer!
We are happy to report more on one of our project results.
After the first 18 months, EuroPAT-MASIP project has the first outcomes of the development work of our six application pilots, available and ready to be presented in conferences. The most advanced of our six pilots, the combined inertial sensor for automotive applications by Murata, has already raised interest in ESTC 2018 and more results are expected to come later this year. Combined multi DOF inertial sensors are used in Electronic Stability Control (ESC) and Advanced Driver Assistance (ADAS) systems, featuring e.g. adaptive cruise control and collision avoidance or automatic lane centering.
Today the ESC controller with sensors is integrated in the air bag unit or in the brake actuator unit, which may cause a lot of mechanic noise in the 1Hz-100kHz frequency range and therefore interfere the sensor’s readings. At the same time the board space is getting scarce with more and more complex component set-ups. In EuroPAT-MASIP our idea was to tackle these problems by using leadless Fan-out wafer level packaging (FO-WLP) technology that will offer significant size reduction and freedom from mechanical resonances in this challenging frequency range. At this point we are excited to tell that both the targeted size reduction and targeted vibration robustness were achieved: The project results confirm that FO-WLP is indeed a viable technology for automotive MEMS packaging.
In the picture here under, an automotive inertial sensor in conventional package and in FOWLP technology.
Many of the results are well beyond the capabilities of the currently used technologies and thus we are confident this new solution will smoothly pass full automotive validation tests], says Murata’s program manager in new technology development Heikki Kuisma. The work continues now with a new lay-out where corrections for the humidity dependence and testability have been implemented and vibration robustness have been further improved, and calibration before assembly in a new tester. A thermo-mechanical model has already been created and it will be verified with experimental results.
Stay tuned! See more news on our LinkedIn page. Did you like this content? We shared this news in our latest newsletter. If you want to receive this information directly into your inbox, you can register to receive our newsletter here
Greetings from Portugal! EuroPAT-MASIP had its 1st year review on 20-21.6.2018 in Vila do Conde, at Amkor premises. The results of the first year look very good already, at we are looking forward to share them with public in the Webinar next week and ETSC Conference next autumn!
