Meet EuroPAT-MASIP at SEMICON EUROPA

EuroPAT-MASIP partners are present at SEMICON Europa November 14th to 17th 2017 in Munich Germany. Say hi to colleagues from Amkor, Advanced Vacuum and Spinverse and discuss the future of electronics packaging! A sneak preview of EuroPAT MASIP Flyer by Advanced Vacuum for SEMICON EUROPA.  

1st press release of the project published

(To see the release as .pdf please click here) EuroPAT-MASIP project secures ECSEL funding to bring semiconductor packaging back to Europe In today’s world, extensive usage of electronic components is at the core of industrial products, ranging from the automotive all the way to the entertainment and defense industries. The specific needs and requirements from…

Work package workshop in Frankfurt

The EuroPAT-MASIP consortium had a workshop 12.7.2017 in Frankfurt, Germany for work package tasks regarding the project’s key functional and performance requirements as well as the test strategy for the application pilots. Birgit Brämer, work package leader from Fraunhofer-Gesellschaft ENAS, presented the status of the task “Key functional and performance requirements”. The task is included in the…

EuroPAT-MASIP at ECSEL SYMPOSIUM 2017

Project coordinator Steffen Kröhnert (NANIUM) was presenting EuroPAT-MASIP at Malta event in June. ECSEL Symposium gathered a wide range of European and global stakeholders in the Electronics Components and Systems field in Malta on 13/14 June 2017 in the the first Symposium, organised by the Joint Undertaking “Electronic Components and Systems for European Leadership” (ECSEL…

EuroPAT-MASIP project kicked off in Berlin

The EuroPAT-MASIP project kicked off in Berlin in 12-13th April 2017 with the full consortium present. The first day focused on the project scope, practicalities and work package presentations by the work package leaders. The second day focused on specifics of the work packages and planning the work. The event was hosted by Fraunhofer IZM.…