Webinar on 28.6.: EuroPAT-MASIP project news

Free Webinar on Thursday 28.6.2018 at 14-17.30 CET: EuroPAT-MASIP ECSEL JU project news – Recent advantages in electronics packaging and related technologies  The webinar summarizes the recent results of the EuroPAT-MASIP ECSEL-JU project, providing a view on industrial FO-WPL based application pilots and packaging related technology developments. The short presentations introduce the topics and highlight the…

Project presented in SEMICON Europa

EuroPAT-MASIP partners were present at SEMICON Europa November 14th 2017 in Munich Germany. During the day the project coordinator Steffen Kröhnert (Amkor) gave two short presentations about the project, and several consortium members were present and available for discussion. Looking forward to see you next year as well!              …

Work package workshop in Frankfurt

The EuroPAT-MASIP consortium had a workshop 12.7.2017 in Frankfurt, Germany for work package tasks regarding the project’s key functional and performance requirements as well as the test strategy for the application pilots. Birgit Brämer, work package leader from Fraunhofer-Gesellschaft ENAS, presented the status of the task “Key functional and performance requirements”. The task is included in the…

EuroPAT-MASIP at ECSEL SYMPOSIUM 2017

Project coordinator Steffen Kröhnert (NANIUM) was presenting EuroPAT-MASIP at Malta event in June. ECSEL Symposium gathered a wide range of European and global stakeholders in the Electronics Components and Systems field in Malta on 13/14 June 2017 in the the first Symposium, organised by the Joint Undertaking “Electronic Components and Systems for European Leadership” (ECSEL…