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18-21st September 2018: the ESTC @ Dresden, Germany
Our project will have its own special session under topic “EuroPAT-MASIP – Recent advantages in electronics packaging” on Wednesday 19th afternoon. Please remember to confirm the exact time from the ESTC2018 website!
16-17th October 2018: EPoSS Annual forum @ Thessaloniki, Greece (Participation of EuroPAT-MASIP not confirmed yet)
13-16th November 2018: Semicon Europe @ Munich, Germany
20-22nd November 2018: EFECS 2018 @ Lisbon, Portugal
Meet EuroPAT-MASIP project partners at our booth!
4-6th December 2018: ICT 2018 @ Vienna, Austria
10-11th April 2019: Smart Systems Integration @ Barcelona
A talk and a poster coming up from several project partners together
13-14th June 2017: ECSEL JU Symposium @ Malta
20-21st June 2017: European SiPAT Member F2F Meeting @ Berlin, Germany
18-20th October 2017: EPoSS annual forum @ Graz, Austria
14-17th November 2017: SEMICON Europa @ Munich, Germany
19-20th June 2018: ECSEL Symposium @ Brussels, Belgium
28-30th August 2018: the ASME 2018 InterPACK @ San Francisco, CA, USA
Talk by Sven Rzepka on “Thermo-mechanical Reliability of the High-Performance Vehicle Computers Enabling Fully Autonomous Driving”