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Upcoming events

28-30th August 2018: the ASME 2018 InterPACK @ San Francisco, CA, USA

Talk  by Sven Rzepka on “Thermo-mechanical Reliability of the High-Performance Vehicle Computers Enabling Fully Autonomous Driving”

18-21st September 2018: the ESTC @ Dresden, Germany

Our project will have its own special session under topic “EuroPAT-MASIP – Recent advantages in electronics packaging”. Stay tuned for updates about the exact time and place!

October 2018: EPoSS Annual forum (Participation of EuroPAT-MASIP not confirmed yet)

13-16th November 2018: Semicon Europe @ Munich, Germany

Past events

13-14th June 2017: ECSEL JU Symposium @ Malta

20-21st June 2017: European SiPAT Member F2F Meeting @ Berlin, Germany

18-20th October 2017: EPoSS annual forum @ Graz, Austria

14-17th November 2017: SEMICON Europa @ Munich, Germany

19-20th June 2018: ECSEL Symposium @ Brussels, Belgium