No publications yet.
28-30th August 2018: the ASME 2018 InterPACK @ San Francisco, CA, USA
Talk by Sven Rzepka on “Thermo-mechanical Reliability of the High-Performance Vehicle Computers Enabling Fully Autonomous Driving”
18-21st September 2018: the ESTC @ Dresden, Germany
Our project will have its own special session under topic “EuroPAT-MASIP – Recent advantages in electronics packaging”. Stay tuned for updates about the exact time and place!
October 2018: EPoSS Annual forum (Participation of EuroPAT-MASIP not confirmed yet)
13-16th November 2018: Semicon Europe @ Munich, Germany
13-14th June 2017: ECSEL JU Symposium @ Malta
20-21st June 2017: European SiPAT Member F2F Meeting @ Berlin, Germany
18-20th October 2017: EPoSS annual forum @ Graz, Austria
14-17th November 2017: SEMICON Europa @ Munich, Germany
19-20th June 2018: ECSEL Symposium @ Brussels, Belgium