EuroPAT-MASIP in ECSEL JU Symposium

Greeting from Bucharest, Romania!

Just like last year, EuroPAT-MASIP project was present at ECSEL JU Symposium 2019 in June 17-18th at Bucharest, Romania. It was once again extremely inspiring to meet so many of you fellow members of the ECS community! In addition to interesting talks and conversations, this year will surely be remembered for its splendid venue – the Palace of the Parliament is genuinely amazing.

EuroPAT-MASIP project members at the Receptions Saloon

More vibes and information about the event:

Smart System Integration (SSI), Barcelona, 9-11th April 2019

Greetings from Barcelona!

M.Sc. Ghanshyam Gadhiya (Fraunhofer ENAS) held a presentation about automated optimization and virtual prototyping of SiP designs. In this research the virtual prototyping approach was used for virtual assessment of FOWLP based automotive inertial sensor, and a complete design assessment was performed automatically. The results demonstrate the capability of this virtual prototyping method.

The full article ‘‘The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs’’ by G. Gadhiya et al. will be published in the conference proceedings of SSI 2019 (Barcelona) later this spring.

Other conferences coming up this spring:

28-31 May 2019: ECTC @ Las Vegas, USA

Wed 29 May 2019, 9-11 AM
Session 37: Interactive Presentations 1
Ayad Ghannam (3DiS Technologies); Birgit Brandstätter (BESI AT); Niek van Haare, Sebastiaan Kersjes (BESI NL); Julian Bravin (EVG); Philippe Meunier (NXP):
Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices

17-18 June 2019: ECSEL JU Symposium @ Bucharest, Romania

EuroPAT-MASIP: Conferences in April 2019

Come to meet EuroPAT-MASIp partners at following events in April:

4th April: IMAPS Microtech 2019 “Power in Packaging” @ UK

10-11th April: SSI 2019 (Smart System Integration) @ Barcelona
EuroPAT-MASIP partners can be met in Test and reliability session on Wednesday 10th of April:

16:50 The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs, Ghanshyam Gadhiya, Fraunhofer Institute for Electronic Nano Systems ENAS

1st year review meeting in Vila do Conde

Greetings from Portugal! EuroPAT-MASIP had its 1st year review on 20-21.6.2018 in Vila do Conde, at Amkor premises. The results of the first year look very good already, at we are looking forward to share them with public in the Webinar next week and ETSC Conference next autumn!

Webinar on 28.6.: EuroPAT-MASIP project news

Free Webinar on Thursday 28.6.2018 at 14-17.30 CET: EuroPAT-MASIP ECSEL JU project news – Recent advantages in electronics packaging and related technologies 

The webinar summarizes the recent results of the EuroPAT-MASIP ECSEL-JU project, providing a view on industrial FO-WPL based application pilots and packaging related technology developments. The short presentations introduce the topics and highlight the key findings.

EuroPAT-MASIP ECSEL-JU project strives to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. The three-year project with 30 M€ total budgets is coordinated by Amkor technologies’ Steffen Kröhnert. The 28 partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user.  www.europat-masip.eu.

Focusing on fan-out wafer level packaging (FO-WLP), the project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor, next-generation WL camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology.

The Webinar highlights the key results achieved during the first 12 months of the project:

  • Peter Iskra, KETEK: Application pilot silicon photomultiplier
  • Heikki Kuisma, Murata: Application pilot automotive combined inertial sensor in FO-WLP packaging technology
  • Gerry Conway, Valeo: Application pilot next-generation WL camera
  • Thilo Lenhard, InnoSenT: Application pilot 60 GHz radar sensor
  • Wojciech Debski, Silicon Radar: 60GHz SiGe BiCMOS MIMO Chip for High-Resolution Radar Sensor
  • Sebastiaan Kersjes, BESI NL: Backend Building Block Development
  • Steffen Kröhnert, Amkor Technology: Packaging Technology, System Integration and Manufacturability
  • Jonas Sing-Pervaiz, RoodMicrotech: Metrology, Characterization, Test Strategy, Reliability and Failure Analysis
  • Ghanshyam Gadhiya, FhG: Automatic Virtual Prototyping of FOWLP in EuroPAT-MASIP
  • Christopher Johnston, Advanced Vacuum: Defect-Free Dicing for Higher Device Reliability

Kindly register to the Webinar using this REGISTRATION LINK. The registrees will be contacted by email for joining instructions.

1st year face-to-face meeting in Lund

The 1st year face-to-face meeting of EuroPAT-MASIP was held in Lund, Sweden on 14-15th of March. The event was hosted by Advanced Vacuum.

Consortium members in the hall of our meeting venue – we were over 40 people in total!

The project is now 1/3 way through and we have spent the first 12 months as planned by concentrating mainly on design, modelling, and simulation related actions. We hope to be able to publish the first results during second half of 2018!

Project presented in SEMICON Europa

Dr. E. Viinikka (Spinverse) and S. Kröhnert (Amkor) with the roll-up of the project

EuroPAT-MASIP partners were present at SEMICON Europa November 14th 2017 in Munich Germany. During the day the project coordinator Steffen Kröhnert (Amkor) gave two short presentations about the project, and several consortium members were present and available for discussion. Looking forward to see you next year as well!

 

 

 

 

 

 

 

 

1st press release of the project published

(To see the release as .pdf please click here)

EuroPAT-MASIP project secures ECSEL funding to bring semiconductor packaging back to Europe

In today’s world, extensive usage of electronic components is at the core of industrial products, ranging from the automotive all the way to the entertainment and defense industries. The specific needs and requirements from the industries have always been one of the strongest technology drivers for advanced electronics packaging. A persistent target is to find new solutions for increased performance, improved form factors and reduced costs. Even though research and development activities in electronics are still in major part done in Europe, the semiconductor packaging related part of the electronics value chain is strongly dominated by countries in Asia.

“EuroPAT-MASIP will consolidate and extend the European leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving various emerging industrial sectors”, tells Steffen Kröhnert, R&D director of Nanium and the Coordinator of the project. “The emerging needs triggered e.g. by automotive sector trends and IoT provide an opportunity to pull back the specific highest added value parts of the electronics value chain back to Europe. The momentum to grasp this opportunity is now, thus it is absolutely great to have ECSEL support for it”, says Kröhnert.

The project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor and a camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology. “The project has the mission to build a key competitive edge to the electronics technology development; We develop new capabilities and demonstrate their match to the future needs of European industries. This accelerates the manufacturing uptake of the new technologies and shorten time-to-market” tells Johanna Anteroinen, project Manager at Spinverse.

The three-year project’s total budget is about 30 M€, with roughly half of it from ECSEL and national funding. Partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user.  www.europat-masip.eu.

About ECSEL JU

The “Electronic Components and Systems for European Leadership” (ECSEL) is a Joint Undertaking established in June 2014 by the European Union Council Regulation No 561/2014. It is  a  public-private partnership  that  will  engage,  from 2014  to  2020,  up  to  1.17  B€  funding  from  the  European  Union’s Horizon 2020 research and innovation programme, combining it with a commensurate amount of  national/ regional  funding  and  participants’  own  contributions  to  leverage  about  5 B€  Research  and  Innovation  investments  in  nanoelectronics,  embedded  and  cyber-physical  systems,  and  system   integration   technologies. The   R&D   actors   are   represented by the associations AENEAS, ARTEMISIA and EPoSS. The ECSEL Joint Undertaking approved funding for 13 new projects totaling to 725 M€ R&D&I effort, receiving financial support from the EU and participating National authorities. The projects are to reinforce smart, sustainable, and inclusive economic growth for Europe, significantly contributing to European competitiveness and job creation. Read more about the ECSEL JU programme.

Project partners:

NANIUM S.A, BESI Austria GmbH, BESI Netherlands BV, EV Group (EVG), Murata Electronics Oy, Pac Tech -Packaging Technologies GmbH, SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG, Valeo Vision Systems (Connaught Electronics Limited), 3DiS Technologies, RoodMicrotec, Sencio, Afore Oy, Micro Analog Systems Oy, Commissariat à l’Energie Atomique Et Aux Energies Alternatives, Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., VTT Technical Research Centre of Finland Ltd, Advanced Vacuum, Packaging SiP, NXP Semiconductors N.V. , Ketek GmbH, Spinverse, Nokian Tyres, InnoSenT, Berliner Nanotest und Design GmbH, AMIC Angewandte Micro-Messtechnik GmbH, Silicon Radar, TexEDA Design GmbH, Elmos Semiconductor AG


More information:

Steffen Kröhnert, Nanium, steffen.kroehnert[at]nanium.com

Satu Ek, Spinverse, satu.ek[at]spinverse.com