The EuroPAT-MASiP project with 28 partners from all over Europe was completed in August 2021, demonstrating a successful and significant overall outcome. The project, funded by the ECSEL JU and national funding agencies, aimed to reinforce the European semiconductor manufacturing position by focusing on the semiconductor and microelectromechanical systems (MEMS) packaging. The results of the project have an impact on the development of new packaging technologies, production and test equipment, as well as on innovative applications by European electronics, component and system manufacturers. Spinverse prepared the funding application and during the project execution supported the project coordinator on the successful management of the project.
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