Smart System Integration (SSI), Barcelona, 9-11th April 2019

Greetings from Barcelona!

M.Sc. Ghanshyam Gadhiya (Fraunhofer ENAS) held a presentation about automated optimization and virtual prototyping of SiP designs. In this research the virtual prototyping approach was used for virtual assessment of FOWLP based automotive inertial sensor, and a complete design assessment was performed automatically. The results demonstrate the capability of this virtual prototyping method.

The full article ‘‘The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs’’ by G. Gadhiya et al. will be published in the conference proceedings of SSI 2019 (Barcelona) later this spring.

Other conferences coming up this spring:

28-31 May 2019: ECTC @ Las Vegas, USA

Wed 29 May 2019, 9-11 AM
Session 37: Interactive Presentations 1
Ayad Ghannam (3DiS Technologies); Birgit Brandstätter (BESI AT); Niek van Haare, Sebastiaan Kersjes (BESI NL); Julian Bravin (EVG); Philippe Meunier (NXP):
Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices

17-18 June 2019: ECSEL JU Symposium @ Bucharest, Romania

EuroPAT-MASIP: Conferences in April 2019

Come to meet EuroPAT-MASIp partners at following events in April:

4th April: IMAPS Microtech 2019 “Power in Packaging” @ UK

10-11th April: SSI 2019 (Smart System Integration) @ Barcelona
EuroPAT-MASIP partners can be met in Test and reliability session on Wednesday 10th of April:

16:50 The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs, Ghanshyam Gadhiya, Fraunhofer Institute for Electronic Nano Systems ENAS

Webinar on 28.6.: EuroPAT-MASIP project news

Free Webinar on Thursday 28.6.2018 at 14-17.30 CET: EuroPAT-MASIP ECSEL JU project news – Recent advantages in electronics packaging and related technologies 

The webinar summarizes the recent results of the EuroPAT-MASIP ECSEL-JU project, providing a view on industrial FO-WPL based application pilots and packaging related technology developments. The short presentations introduce the topics and highlight the key findings.

EuroPAT-MASIP ECSEL-JU project strives to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. The three-year project with 30 M€ total budgets is coordinated by Amkor technologies’ Steffen Kröhnert. The 28 partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user.  www.europat-masip.eu.

Focusing on fan-out wafer level packaging (FO-WLP), the project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor, next-generation WL camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology.

The Webinar highlights the key results achieved during the first 12 months of the project:

  • Peter Iskra, KETEK: Application pilot silicon photomultiplier
  • Heikki Kuisma, Murata: Application pilot automotive combined inertial sensor in FO-WLP packaging technology
  • Gerry Conway, Valeo: Application pilot next-generation WL camera
  • Thilo Lenhard, InnoSenT: Application pilot 60 GHz radar sensor
  • Wojciech Debski, Silicon Radar: 60GHz SiGe BiCMOS MIMO Chip for High-Resolution Radar Sensor
  • Sebastiaan Kersjes, BESI NL: Backend Building Block Development
  • Steffen Kröhnert, Amkor Technology: Packaging Technology, System Integration and Manufacturability
  • Jonas Sing-Pervaiz, RoodMicrotech: Metrology, Characterization, Test Strategy, Reliability and Failure Analysis
  • Ghanshyam Gadhiya, FhG: Automatic Virtual Prototyping of FOWLP in EuroPAT-MASIP
  • Christopher Johnston, Advanced Vacuum: Defect-Free Dicing for Higher Device Reliability

Kindly register to the Webinar using this REGISTRATION LINK. The registrees will be contacted by email for joining instructions.

Project presented in SEMICON Europa

Dr. E. Viinikka (Spinverse) and S. Kröhnert (Amkor) with the roll-up of the project

EuroPAT-MASIP partners were present at SEMICON Europa November 14th 2017 in Munich Germany. During the day the project coordinator Steffen Kröhnert (Amkor) gave two short presentations about the project, and several consortium members were present and available for discussion. Looking forward to see you next year as well!