As an ecsel project EuroPAT-MASIP has always participated on Ecsel JU symposium in June. This year’s event will be on wednesday 24th of June, and the event is virtual and free of charge: remember to register here!
EFECS 2019 was organized in 19-21st of November in Helsinki this year, and EuroPAT-MASIP project partners participated from all over the Europe. It was great to meet you all in Finlandia Hall and later in the Helsinki City Hall, especially now that we had the latest results to discuss about from the 2nd review meeting!
Our stand could be found in the Exhibition area, next to a newer ECSEL project Applause whom with we share several partners.
Greeting from Bucharest, Romania!
Just like last year, EuroPAT-MASIP project was present at ECSEL JU Symposium 2019 in June 17-18th at Bucharest, Romania. It was once again extremely inspiring to meet so many of you fellow members of the ECS community! In addition to interesting talks and conversations, this year will surely be remembered for its splendid venue – the Palace of the Parliament is genuinely amazing.
More vibes and information about the event:
Greetings from Barcelona!
M.Sc. Ghanshyam Gadhiya (Fraunhofer ENAS) held a presentation about automated optimization and virtual prototyping of SiP designs. In this research the virtual prototyping approach was used for virtual assessment of FOWLP based automotive inertial sensor, and a complete design assessment was performed automatically. The results demonstrate the capability of this virtual prototyping method.
The full article ‘‘The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs’’ by G. Gadhiya et al. will be published in the conference proceedings of SSI 2019 (Barcelona) later this spring.
Other conferences coming up this spring:
28-31 May 2019: ECTC @ Las Vegas, USA
Wed 29 May 2019, 9-11 AM
Session 37: Interactive Presentations 1
Ayad Ghannam (3DiS Technologies); Birgit Brandstätter (BESI AT); Niek van Haare, Sebastiaan Kersjes (BESI NL); Julian Bravin (EVG); Philippe Meunier (NXP):
Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices
17-18 June 2019: ECSEL JU Symposium @ Bucharest, Romania
Come to meet EuroPAT-MASIp partners at following events in April:
4th April: IMAPS Microtech 2019 “Power in Packaging” @ UK
10-11th April: SSI 2019 (Smart System Integration) @ Barcelona
EuroPAT-MASIP partners can be met in Test and reliability session on Wednesday 10th of April:
16:50 The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs, Ghanshyam Gadhiya, Fraunhofer Institute for Electronic Nano Systems ENAS
Free Webinar on Thursday 28.6.2018 at 14-17.30 CET: EuroPAT-MASIP ECSEL JU project news – Recent advantages in electronics packaging and related technologies
The webinar summarizes the recent results of the EuroPAT-MASIP ECSEL-JU project, providing a view on industrial FO-WPL based application pilots and packaging related technology developments. The short presentations introduce the topics and highlight the key findings.
EuroPAT-MASIP ECSEL-JU project strives to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. The three-year project with 30 M€ total budgets is coordinated by Amkor technologies’ Steffen Kröhnert. The 28 partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user. www.europat-masip.eu.
Focusing on fan-out wafer level packaging (FO-WLP), the project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor, next-generation WL camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology.
The Webinar highlights the key results achieved during the first 12 months of the project:
- Peter Iskra, KETEK: Application pilot silicon photomultiplier
- Heikki Kuisma, Murata: Application pilot automotive combined inertial sensor in FO-WLP packaging technology
- Gerry Conway, Valeo: Application pilot next-generation WL camera
- Thilo Lenhard, InnoSenT: Application pilot 60 GHz radar sensor
- Wojciech Debski, Silicon Radar: 60GHz SiGe BiCMOS MIMO Chip for High-Resolution Radar Sensor
- Sebastiaan Kersjes, BESI NL: Backend Building Block Development
- Steffen Kröhnert, Amkor Technology: Packaging Technology, System Integration and Manufacturability
- Jonas Sing-Pervaiz, RoodMicrotech: Metrology, Characterization, Test Strategy, Reliability and Failure Analysis
- Ghanshyam Gadhiya, FhG: Automatic Virtual Prototyping of FOWLP in EuroPAT-MASIP
- Christopher Johnston, Advanced Vacuum: Defect-Free Dicing for Higher Device Reliability
Kindly register to the Webinar using this REGISTRATION LINK. The registrees will be contacted by email for joining instructions.
EuroPAT-MASIP partners were present at SEMICON Europa November 14th 2017 in Munich Germany. During the day the project coordinator Steffen Kröhnert (Amkor) gave two short presentations about the project, and several consortium members were present and available for discussion. Looking forward to see you next year as well!