Minho students visiting ATEP in February

Having great experts in your team now is an important thing, but so is having them in future: in February 6th, 31 students from University of Minho visited Amkor Technology Portugal (ATEP).

The students were introduced to the state-of-the-art of packaging technology, the projects where ATEP is involved (including EuroPAT-MASIP!) and the project targets.

Thank you for the visit, hopefully we’ll meet again!

Prototypes and progress shown in the 2nd review meeting

The second review meeting of EuroPAT-MASIP was organized in Brussels in the last week of October 2019, and we were proud to present the progress we have made since the first review! We now have prototypes of 3/6 application pilots, and certain partners have also detected new tools and improvements to their processes. We are very excited to see how this new know-how will affect on semiconductor and MEMS manufacturing business during upcoming years.

We are looking forward to tell more about these prototypes and results in a press release in December, so stay tuned!

A well-deserved dinner after the review meeting – thank you for all AP and TLV owners, WP leaders, reviewers and our great project officer!


Latest update from our partner Murata

We are happy to report more on one of our project results.

After the first 18 months, EuroPAT-MASIP project has the first outcomes of the development work of our six application pilots, available and ready to be presented in conferences. The most advanced of our six pilots, the combined inertial sensor for automotive applications by Murata, has already raised interest in ESTC 2018 and more results are expected to come later this year. Combined multi DOF inertial sensors are used in Electronic Stability Control (ESC) and Advanced Driver Assistance (ADAS) systems, featuring e.g. adaptive cruise control and collision avoidance or automatic lane centering.

Today the ESC controller with sensors is integrated in the air bag unit or in the brake actuator unit, which may cause a lot of mechanic noise in the 1Hz-100kHz frequency range and therefore interfere the sensor’s readings. At the same time the board space is getting scarce with more and more complex component set-ups. In EuroPAT-MASIP our idea was to tackle these problems by using leadless Fan-out wafer level packaging (FO-WLP) technology that will offer significant size reduction and freedom from mechanical resonances in this challenging frequency range. At this point we are excited to tell that both the targeted size reduction and targeted vibration robustness were achieved: The project results confirm that FO-WLP is indeed a viable technology for automotive MEMS packaging.

In the picture here under, an automotive inertial sensor in conventional package and in FOWLP technology.

Many of the results are well beyond the capabilities of the currently used technologies and thus we are confident this new solution will smoothly pass full automotive validation tests], says Murata’s program manager in new technology development Heikki Kuisma. The work continues now with a new lay-out where corrections for the humidity dependence and testability have been implemented and vibration robustness have been further improved, and calibration before assembly in a new tester. A thermo-mechanical model has already been created and it will be verified with experimental results.

Stay tuned! See more news on our LinkedIn page.
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1st year review meeting in Vila do Conde

Greetings from Portugal! EuroPAT-MASIP had its 1st year review on 20-21.6.2018 in Vila do Conde, at Amkor premises. The results of the first year look very good already, at we are looking forward to share them with public in the Webinar next week and ETSC Conference next autumn!

1st year face-to-face meeting in Lund

The 1st year face-to-face meeting of EuroPAT-MASIP was held in Lund, Sweden on 14-15th of March. The event was hosted by Advanced Vacuum.

Consortium members in the hall of our meeting venue – we were over 40 people in total!

The project is now 1/3 way through and we have spent the first 12 months as planned by concentrating mainly on design, modelling, and simulation related actions. We hope to be able to publish the first results during second half of 2018!

1st press release of the project published

(To see the release as .pdf please click here)

EuroPAT-MASIP project secures ECSEL funding to bring semiconductor packaging back to Europe

In today’s world, extensive usage of electronic components is at the core of industrial products, ranging from the automotive all the way to the entertainment and defense industries. The specific needs and requirements from the industries have always been one of the strongest technology drivers for advanced electronics packaging. A persistent target is to find new solutions for increased performance, improved form factors and reduced costs. Even though research and development activities in electronics are still in major part done in Europe, the semiconductor packaging related part of the electronics value chain is strongly dominated by countries in Asia.

“EuroPAT-MASIP will consolidate and extend the European leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving various emerging industrial sectors”, tells Steffen Kröhnert, R&D director of Nanium and the Coordinator of the project. “The emerging needs triggered e.g. by automotive sector trends and IoT provide an opportunity to pull back the specific highest added value parts of the electronics value chain back to Europe. The momentum to grasp this opportunity is now, thus it is absolutely great to have ECSEL support for it”, says Kröhnert.

The project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor and a camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology. “The project has the mission to build a key competitive edge to the electronics technology development; We develop new capabilities and demonstrate their match to the future needs of European industries. This accelerates the manufacturing uptake of the new technologies and shorten time-to-market” tells Johanna Anteroinen, project Manager at Spinverse.

The three-year project’s total budget is about 30 M€, with roughly half of it from ECSEL and national funding. Partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user.  www.europat-masip.eu.

About ECSEL JU

The “Electronic Components and Systems for European Leadership” (ECSEL) is a Joint Undertaking established in June 2014 by the European Union Council Regulation No 561/2014. It is  a  public-private partnership  that  will  engage,  from 2014  to  2020,  up  to  1.17  B€  funding  from  the  European  Union’s Horizon 2020 research and innovation programme, combining it with a commensurate amount of  national/ regional  funding  and  participants’  own  contributions  to  leverage  about  5 B€  Research  and  Innovation  investments  in  nanoelectronics,  embedded  and  cyber-physical  systems,  and  system   integration   technologies. The   R&D   actors   are   represented by the associations AENEAS, ARTEMISIA and EPoSS. The ECSEL Joint Undertaking approved funding for 13 new projects totaling to 725 M€ R&D&I effort, receiving financial support from the EU and participating National authorities. The projects are to reinforce smart, sustainable, and inclusive economic growth for Europe, significantly contributing to European competitiveness and job creation. Read more about the ECSEL JU programme.

Project partners:

NANIUM S.A, BESI Austria GmbH, BESI Netherlands BV, EV Group (EVG), Murata Electronics Oy, Pac Tech -Packaging Technologies GmbH, SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG, Valeo Vision Systems (Connaught Electronics Limited), 3DiS Technologies, RoodMicrotec, Sencio, Afore Oy, Micro Analog Systems Oy, Commissariat à l’Energie Atomique Et Aux Energies Alternatives, Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., VTT Technical Research Centre of Finland Ltd, Advanced Vacuum, Packaging SiP, NXP Semiconductors N.V. , Ketek GmbH, Spinverse, Nokian Tyres, InnoSenT, Berliner Nanotest und Design GmbH, AMIC Angewandte Micro-Messtechnik GmbH, Silicon Radar, TexEDA Design GmbH, Elmos Semiconductor AG


More information:

Steffen Kröhnert, Nanium, steffen.kroehnert[at]nanium.com

Satu Ek, Spinverse, satu.ek[at]spinverse.com