Tekniikka ja Talous, a Finnish news magazine focusing on technology innovations writes about EuroPAT-MASIP in their issue 29/2017 (published on Friday 22nd of September).
The article (in Finnish) can read on the print version and web page of Tekniikka ja talous.
The EuroPAT-MASIP consortium had a workshop 12.7.2017 in Frankfurt, Germany for work package tasks regarding the project’s key functional and performance requirements as well as the test strategy for the application pilots.
Birgit Brämer, work package leader from Fraunhofer-Gesellschaft ENAS, presented the status of the task “Key functional and performance requirements”. The task is included in the work package that focuses on integration concepts, design, modelling and simulation. The objective of the task is specify what technology and manufacturing requirements are needed for the application pilots. These requirements and guidelines will provide input for the following work packages to come.
Reinhard Pusch, COO from RoodMicrotec, presented the status of the task “Test strategy for the application pilots”. RoodMicrotec is in charge of this task and it will develop test strategies for the application pilots in collaboration with the application pilot partners. The task is included in the work package “Metrology, Characterization, Test Strategy, Reliability and Failure Analysis”, which Pusch presented as well.
The workshop also discussed the coordination of the project work as well as the partner contributions. André Cardoso, Nanium’s R&D Integrator, held discussions on the collaborations between work packages and application pilot timings.
Project coordinator Steffen Kröhnert (NANIUM) was presenting EuroPAT-MASIP at Malta event in June.
ECSEL Symposium gathered a wide range of European and global stakeholders in the Electronics Components and Systems field in Malta on 13/14 June 2017 in the the first Symposium, organised by the Joint Undertaking “Electronic Components and Systems for European Leadership” (ECSEL JU).
The ECSEL Symposium provided the space for ECSEL funded projects to present their progress and results. The event run over two days: Day 1 focuses on ECSEL JU projects’ results and achievements in key areas (e.g. Smart Health, Production, and Mobility and Semiconductor technologies) while Day 2 is dedicated to a more strategic exchange featuring high-profile key note speeches and panel discussions. This event was organised under the auspices of the 2017 Maltese Presidency of the Council of the European Union.
The EuroPAT-MASIP project kicked off in Berlin in 12-13th April 2017 with the full consortium present. The first day focused on the project scope, practicalities and work package presentations by the work package leaders. The second day focused on specifics of the work packages and planning the work. The event was hosted by Fraunhofer IZM.
The project will continue for 36 months and aims to reinforce the European semiconductor manufacturing position through focusing in the semiconductor and MEMS packaging ecosystem.