EuroPAT-MASIP participates on EuroSimE 2020 Virtual event on June 6-27th!
A paper “Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line” by Fraunhofer ENAS in co-op. with Murata and Amkor teams is part of the session on Thermo-mechanical simulations for advanced technologies.
For more information about the event, full programme and registration:
https://www.eurosime.org/
Reinforcing the European semiconductor industry