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EuroPAT-MASIP
EuroPAT-MASIP

EuroPAT-MASIP

Reinforcing the European semiconductor industry

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Materials

Here you can find some more interesting materials we have shared in conferences and/or industry events.

IMAPS Device packaging 2021

Conference article by Anshuma Pathak et al: Chip package bumping on Wafer-level for RDL First Fan-out Wafers

Chip-package-bumping_imaps_PathakDownload

EFECS 2020

EuroPAT-MASIP general presentation in EFECS2020Download
EuroPAT-MASIP research result highlightsDownload
EuroPAT-MASIP ASME Outstandin paper award -poster by G. Gadhiya et al.Download

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.
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