EuroPAT-MASiP project on Electronics Packaging has been successfully completed!

The EuroPAT-MASiP project with 28 partners from all over Europe was completed in August 2021, demonstrating a successful and significant overall outcome. The project, funded by the ECSEL JU and national funding agencies, aimed to reinforce the European semiconductor manufacturing position by focusing on the semiconductor and microelectromechanical systems (MEMS) packaging. The results of the project have an impact on the development of new packaging technologies, production and test equipment, as well as on innovative applications by European electronics, component and system manufacturers. Spinverse prepared the funding application and during the project execution supported the project coordinator on the successful management of the project.

Read the full Press release here.

The final review over!

After over 4 years, EuroPAT-MASIP consortium can proudly state that we have officially had the final review and the project has come to an end…

…yet the co-operation on certain work packages and use cases was so fruitful that the work continues in follow-up or other R&D projects.

Thank you all for this interesting journey! And stay tuned for the final press release about the results.

The final review meeting was organized in 2020-2021 style, as MS Teams meeting

Smart Systems Integration 2021 in April 27-28

The Smart Systems Integration Conference 2021 conference takes place April 27th to 29th, 2021 as a virtual event. Being one of the organizers, a EuroPAT-MASIP partner Franhofer ENAS invites you all to participate!

The presentations of Smart Systems Integration Conference will take place on three mornings (27.04. – 29.04.) from 9 – 12 a.m. The experts will present their latest findings in the field of Smart Systems along the whole of the value chain, starting from MEMS/NEMS, photonics, micromechanics, microfluidics, printed functionalities through to complete systems and different application scenarios.

More information on the event website:

Greeting from the 3rd review

Some 45 months of work done, only 6 more to go.

EuroPAT-MASIP had its 3rd review meeting on Wednesday this week, thanks for the reviewers for their positive and encouraging feedback! The remaining six months will be busy with the last deliverables and testings, but it definitely looks like the first results will be exploited commercially very soon after the project ends in June 2021. Exciting times!

Now, happy holidays for everyone and even happier new year 2021!

EuroSimE 2020: paper and presentation from our partners!

EuroPAT-MASIP participates on EuroSimE 2020 Virtual event on June 6-27th!

A paper “Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
” by Fraunhofer ENAS in co-op. with Murata and Amkor teams is part of the session on Thermo-mechanical simulations for advanced technologies.

For more information about the event, full programme and registration:

Minho students visiting ATEP in February

Having great experts in your team now is an important thing, but so is having them in future: in February 6th, 31 students from University of Minho visited Amkor Technology Portugal (ATEP).

The students were introduced to the state-of-the-art of packaging technology, the projects where ATEP is involved (including EuroPAT-MASIP!) and the project targets.

Thank you for the visit, hopefully we’ll meet again!

Presenting the project in EFECS 2019

EFECS 2019 was organized in 19-21st of November in Helsinki this year, and EuroPAT-MASIP project partners participated from all over the Europe. It was great to meet you all in Finlandia Hall and later in the Helsinki City Hall, especially now that we had the latest results to discuss about from the 2nd review meeting!

Our stand could be found in the Exhibition area, next to a newer ECSEL project Applause whom with we share several partners.