EFECS 2019 was organized in 19-21st of November in Helsinki this year, and EuroPAT-MASIP project partners participated from all over the Europe. It was great to meet you all in Finlandia Hall and later in the Helsinki City Hall, especially now that we had the latest results to discuss about from the 2nd review meeting!
Our stand could be found in the Exhibition area, next to a newer ECSEL project Applause whom with we share several partners.
The second review meeting of EuroPAT-MASIP was organized in Brussels in the last week of October 2019, and we were proud to present the progress we have made since the first review! We now have prototypes of 3/6 application pilots, and certain partners have also detected new tools and improvements to their processes. We are very excited to see how this new know-how will affect on semiconductor and MEMS manufacturing business during upcoming years.
We are looking forward to tell more about these prototypes and results in a press release in December, so stay tuned!
Just like last year, EuroPAT-MASIP project was present at ECSEL JU Symposium 2019 in June 17-18th at Bucharest, Romania. It was once again extremely inspiring to meet so many of you fellow members of the ECS community! In addition to interesting talks and conversations, this year will surely be remembered for its splendid venue – the Palace of the Parliament is genuinely amazing.
M.Sc. Ghanshyam Gadhiya (Fraunhofer ENAS) held a presentation about automated optimization and virtual prototyping of SiP designs. In this research the virtual prototyping approach was used for virtual assessment of FOWLP based automotive inertial sensor, and a complete design assessment was performed automatically. The results demonstrate the capability of this virtual prototyping method.
The full article ‘‘The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs’’ by G. Gadhiya et al. will be published in the conference proceedings of SSI 2019 (Barcelona) later this spring.
We are happy to report more on one of our project results.
After the first 18 months, EuroPAT-MASIP project has the first outcomes of the development work of our six application pilots, available and ready to be presented in conferences. The most advanced of our six pilots, the combined inertial sensor for automotive applications by Murata, has already raised interest in ESTC 2018 and more results are expected to come later this year. Combined multi DOF inertial sensors are used in Electronic Stability Control (ESC) and Advanced Driver Assistance (ADAS) systems, featuring e.g. adaptive cruise control and collision avoidance or automatic lane centering.
Today the ESC controller with sensors is integrated in the air bag unit or in the brake actuator unit, which may cause a lot of mechanic noise in the 1Hz-100kHz frequency range and therefore interfere the sensor’s readings. At the same time the board space is getting scarce with more and more complex component set-ups. In EuroPAT-MASIP our idea was to tackle these problems by using leadless Fan-out wafer level packaging (FO-WLP) technology that will offer significant size reduction and freedom from mechanical resonances in this challenging frequency range. At this point we are excited to tell that both the targeted size reduction and targeted vibration robustness were achieved: The project results confirm that FO-WLP is indeed a viable technology for automotive MEMS packaging.
In the picture here under, an automotive inertial sensor in conventional package and in FOWLP technology.
Many of the results are well beyond the capabilities of the currently used technologies and thus we are confident this new solution will smoothly pass full automotive validation tests], says Murata’s program manager in new technology development Heikki Kuisma. The work continues now with a new lay-out where corrections for the humidity dependence and testability have been implemented and vibration robustness have been further improved, and calibration before assembly in a new tester. A thermo-mechanical model has already been created and it will be verified with experimental results.
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Greetings from Portugal! EuroPAT-MASIP had its 1st year review on 20-21.6.2018 in Vila do Conde, at Amkor premises. The results of the first year look very good already, at we are looking forward to share them with public in the Webinar next week and ETSC Conference next autumn!
Free Webinar on Thursday 28.6.2018 at 14-17.30 CET: EuroPAT-MASIP ECSEL JU project news – Recent advantages in electronics packaging and related technologies
The webinar summarizes the recent results of the EuroPAT-MASIP ECSEL-JU project, providing a view on industrial FO-WPL based application pilots and packaging related technology developments.The short presentations introduce the topics and highlight the key findings.
EuroPAT-MASIP ECSEL-JU project strives to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. The three-year project with 30 M€ total budgets is coordinated by Amkor technologies’ Steffen Kröhnert. The 28 partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user. www.europat-masip.eu.
Focusing on fan-out wafer level packaging (FO-WLP), the project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor, next-generation WL camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology.
The Webinar highlights the key results achieved during the first 12 months of the project:
Peter Iskra, KETEK: Application pilot silicon photomultiplier
Heikki Kuisma, Murata: Application pilot automotive combined inertial sensor in FO-WLP packaging technology
Gerry Conway, Valeo: Application pilot next-generation WL camera
Thilo Lenhard, InnoSenT: Application pilot 60 GHz radar sensor
Wojciech Debski, Silicon Radar: 60GHz SiGe BiCMOS MIMO Chip for High-Resolution Radar Sensor
Sebastiaan Kersjes, BESI NL: Backend Building Block Development
Steffen Kröhnert, Amkor Technology: Packaging Technology, System Integration and Manufacturability
Jonas Sing-Pervaiz, RoodMicrotech: Metrology, Characterization, Test Strategy, Reliability and Failure Analysis
Ghanshyam Gadhiya, FhG: Automatic Virtual Prototyping of FOWLP in EuroPAT-MASIP
Christopher Johnston, Advanced Vacuum: Defect-Free Dicing for Higher Device Reliability
Kindly register to the Webinar using this REGISTRATION LINK. The registrees will be contacted by email for joining instructions.
The 1st year face-to-face meeting of EuroPAT-MASIP was held in Lund, Sweden on 14-15th of March. The event was hosted by Advanced Vacuum.
The project is now 1/3 way through and we have spent the first 12 months as planned by concentrating mainly on design, modelling, and simulation related actions. We hope to be able to publish the first results during second half of 2018!
EuroPAT-MASIP partners were present at SEMICON Europa November 14th 2017 in Munich Germany. During the day the project coordinator Steffen Kröhnert (Amkor) gave two short presentations about the project, and several consortium members were present and available for discussion. Looking forward to see you next year as well!