EuroPAT-MASIP participates on EuroSimE 2020 Virtual event on June 6-27th! A paper “Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line” by Fraunhofer ENAS in co-op. with Murata and Amkor teams is part of the session on Thermo-mechanical simulations for advanced technologies.
As an ecsel project EuroPAT-MASIP has always participated on Ecsel JU symposium in June. This year’s event will be on wednesday 24th of June, and the event is virtual and free of charge: remember to register here!
EFECS 2019 was organized in 19-21st of November in Helsinki this year, and EuroPAT-MASIP project partners participated from all over the Europe. It was great to meet you all in Finlandia Hall and later in the Helsinki City Hall, especially now that we had the latest results to discuss about from the 2nd review meeting!
Our stand could be found in the Exhibition area, next to a newer ECSEL project Applause whom with we share several partners.
The second review meeting of EuroPAT-MASIP was organized in Brussels in the last week of October 2019, and we were proud to present the progress we have made since the first review! We now have prototypes of 3/6 application pilots, and certain partners have also detected new tools and improvements to their processes. We are very excited to see how this new know-how will affect on semiconductor and MEMS manufacturing business during upcoming years.
We are looking forward to tell more about these prototypes and results in a press release in December, so stay tuned!
Just like last year, EuroPAT-MASIP project was present at ECSEL JU Symposium 2019 in June 17-18th at Bucharest, Romania. It was once again extremely inspiring to meet so many of you fellow members of the ECS community! In addition to interesting talks and conversations, this year will surely be remembered for its splendid venue – the Palace of the Parliament is genuinely amazing.
M.Sc. Ghanshyam Gadhiya (Fraunhofer ENAS) held a presentation about automated optimization and virtual prototyping of SiP designs. In this research the virtual prototyping approach was used for virtual assessment of FOWLP based automotive inertial sensor, and a complete design assessment was performed automatically. The results demonstrate the capability of this virtual prototyping method.
The full article ‘‘The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs’’ by G. Gadhiya et al. will be published in the conference proceedings of SSI 2019 (Barcelona) later this spring.
We are happy to report more on one of our project results.
After the first 18 months, EuroPAT-MASIP project has the first outcomes of the development work of our six application pilots, available and ready to be presented in conferences. The most advanced of our six pilots, the combined inertial sensor for automotive applications by Murata, has already raised interest in ESTC 2018 and more results are expected to come later this year. Combined multi DOF inertial sensors are used in Electronic Stability Control (ESC) and Advanced Driver Assistance (ADAS) systems, featuring e.g. adaptive cruise control and collision avoidance or automatic lane centering.
Today the ESC controller with sensors is integrated in the air bag unit or in the brake actuator unit, which may cause a lot of mechanic noise in the 1Hz-100kHz frequency range and therefore interfere the sensor’s readings. At the same time the board space is getting scarce with more and more complex component set-ups. In EuroPAT-MASIP our idea was to tackle these problems by using leadless Fan-out wafer level packaging (FO-WLP) technology that will offer significant size reduction and freedom from mechanical resonances in this challenging frequency range. At this point we are excited to tell that both the targeted size reduction and targeted vibration robustness were achieved: The project results confirm that FO-WLP is indeed a viable technology for automotive MEMS packaging.
In the picture here under, an automotive inertial sensor in conventional package and in FOWLP technology.
Many of the results are well beyond the capabilities of the currently used technologies and thus we are confident this new solution will smoothly pass full automotive validation tests], says Murata’s program manager in new technology development Heikki Kuisma. The work continues now with a new lay-out where corrections for the humidity dependence and testability have been implemented and vibration robustness have been further improved, and calibration before assembly in a new tester. A thermo-mechanical model has already been created and it will be verified with experimental results.
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