News

The EuroPAT-MASiP project with 28 partners from all over Europe was completed in August 2021, demonstrating a successful and significant overall outcome. The project, funded by the ECSEL JU and national funding agencies, aimed to reinforce the European semiconductor manufacturing position by focusing on the semiconductor and microelectromechanical systems (MEMS) packaging. The results of the project have an impact on the development of new packaging technologies, production and test equipment, as well as on innovative applications by European electronics, component and system manufacturers. Spinverse prepared the funding application and during the project execution supported the project coordinator on the successful management of the project.

Read the full Press release here.

After over 4 years, EuroPAT-MASIP consortium can proudly state that we have officially had the final review and the project has come to an end…

…yet the co-operation on certain work packages and use cases was so fruitful that the work continues in follow-up or other R&D projects.

Thank you all for this interesting journey! And stay tuned for the final press release about the results.

The Smart Systems Integration Conference 2021 conference takes place April 27th to 29th, 2021 as a virtual event. Being one of the organizers, a EuroPAT-MASIP partner Franhofer ENAS invites you all to participate!

The presentations of Smart Systems Integration Conference will take place on three mornings (27.04. – 29.04.) from 9 – 12 a.m. The experts will present their latest findings in the field of Smart Systems along the whole of the value chain, starting from MEMS/NEMS, photonics, micromechanics, microfluidics, printed functionalities through to complete systems and different application scenarios.

More information on the event website: http://smartsystemsintegration.com/

Some 45 months of work done, only 6 more to go.

EuroPAT-MASIP had its 3rd review meeting on Wednesday this week, thanks for the reviewers for their positive and encouraging feedback! The remaining six months will be busy with the last deliverables and testings, but it definitely looks like the first results will be exploited commercially very soon after the project ends in June 2021. Exciting times!

Now, happy holidays for everyone and even happier new year 2021!

EuroPAT-MASIP team from Fraunhofer ENAS, Besi NL and Amkor has been awarded with the Outstanding Paper Award at ASME 2020 InterPACK Conference (oct 27-28. 2020) for their paper “The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods” .

Congratulations to Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes and Felandorio Fernandes!

The brand-new edition of the Handbook of Silicon Based MEMA materials and technologies was published in spring 2020, and can now be purchased from publisher!

The book includes one chapter (Chapter 33 – Fan-out wafer-level packaging as packaging technology for MEMS) written by EuroPAT-MASIP project members from ATEP, Murata and Fraunhofer IZM.

Having great experts in your team now is an important thing, but so is having them in future: in February 6th, 31 students from University of Minho visited Amkor Technology Portugal (ATEP).

The students were introduced to the state-of-the-art of packaging technology, the projects where ATEP is involved (including EuroPAT-MASIP!) and the project targets.

Thank you for the visit, hopefully we’ll meet again!