Smart System Integration (SSI), Barcelona, 9-11th April 2019

Greetings from Barcelona!

M.Sc. Ghanshyam Gadhiya (Fraunhofer ENAS) held a presentation about automated optimization and virtual prototyping of SiP designs. In this research the virtual prototyping approach was used for virtual assessment of FOWLP based automotive inertial sensor, and a complete design assessment was performed automatically. The results demonstrate the capability of this virtual prototyping method.

The full article ‘‘The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs’’ by G. Gadhiya et al. will be published in the conference proceedings of SSI 2019 (Barcelona) later this spring.

Other conferences coming up this spring:

28-31 May 2019: ECTC @ Las Vegas, USA

Wed 29 May 2019, 9-11 AM
Session 37: Interactive Presentations 1
Ayad Ghannam (3DiS Technologies); Birgit Brandstätter (BESI AT); Niek van Haare, Sebastiaan Kersjes (BESI NL); Julian Bravin (EVG); Philippe Meunier (NXP):
Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices

17-18 June 2019: ECSEL JU Symposium @ Bucharest, Romania

EuroPAT-MASIP: Conferences in April 2019

Come to meet EuroPAT-MASIp partners at following events in April:

4th April: IMAPS Microtech 2019 “Power in Packaging” @ UK

10-11th April: SSI 2019 (Smart System Integration) @ Barcelona
EuroPAT-MASIP partners can be met in Test and reliability session on Wednesday 10th of April:

16:50 The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs, Ghanshyam Gadhiya, Fraunhofer Institute for Electronic Nano Systems ENAS

Latest update from our partner Murata

We are happy to report more on one of our project results.

After the first 18 months, EuroPAT-MASIP project has the first outcomes of the development work of our six application pilots, available and ready to be presented in conferences. The most advanced of our six pilots, the combined inertial sensor for automotive applications by Murata, has already raised interest in ESTC 2018 and more results are expected to come later this year. Combined multi DOF inertial sensors are used in Electronic Stability Control (ESC) and Advanced Driver Assistance (ADAS) systems, featuring e.g. adaptive cruise control and collision avoidance or automatic lane centering.

Today the ESC controller with sensors is integrated in the air bag unit or in the brake actuator unit, which may cause a lot of mechanic noise in the 1Hz-100kHz frequency range and therefore interfere the sensor’s readings. At the same time the board space is getting scarce with more and more complex component set-ups. In EuroPAT-MASIP our idea was to tackle these problems by using leadless Fan-out wafer level packaging (FO-WLP) technology that will offer significant size reduction and freedom from mechanical resonances in this challenging frequency range. At this point we are excited to tell that both the targeted size reduction and targeted vibration robustness were achieved: The project results confirm that FO-WLP is indeed a viable technology for automotive MEMS packaging.

In the picture here under, an automotive inertial sensor in conventional package and in FOWLP technology.

Many of the results are well beyond the capabilities of the currently used technologies and thus we are confident this new solution will smoothly pass full automotive validation tests], says Murata’s program manager in new technology development Heikki Kuisma. The work continues now with a new lay-out where corrections for the humidity dependence and testability have been implemented and vibration robustness have been further improved, and calibration before assembly in a new tester. A thermo-mechanical model has already been created and it will be verified with experimental results.

Stay tuned! See more news on our LinkedIn page.
Did you like this content? We shared this news in our latest newsletter. If you want to receive this information directly into your inbox, you can register to receive our newsletter here

1st year review meeting in Vila do Conde

Greetings from Portugal! EuroPAT-MASIP had its 1st year review on 20-21.6.2018 in Vila do Conde, at Amkor premises. The results of the first year look very good already, at we are looking forward to share them with public in the Webinar next week and ETSC Conference next autumn!

Webinar on 28.6.: EuroPAT-MASIP project news

Free Webinar on Thursday 28.6.2018 at 14-17.30 CET: EuroPAT-MASIP ECSEL JU project news – Recent advantages in electronics packaging and related technologies 

The webinar summarizes the recent results of the EuroPAT-MASIP ECSEL-JU project, providing a view on industrial FO-WPL based application pilots and packaging related technology developments. The short presentations introduce the topics and highlight the key findings.

EuroPAT-MASIP ECSEL-JU project strives to increase the competitiveness and the global market share of the European semiconductor industry by fostering the competence and capabilities of semiconductor packaging. The three-year project with 30 M€ total budgets is coordinated by Amkor technologies’ Steffen Kröhnert. The 28 partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user.  www.europat-masip.eu.

Focusing on fan-out wafer level packaging (FO-WLP), the project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor, next-generation WL camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology.

The Webinar highlights the key results achieved during the first 12 months of the project:

  • Peter Iskra, KETEK: Application pilot silicon photomultiplier
  • Heikki Kuisma, Murata: Application pilot automotive combined inertial sensor in FO-WLP packaging technology
  • Gerry Conway, Valeo: Application pilot next-generation WL camera
  • Thilo Lenhard, InnoSenT: Application pilot 60 GHz radar sensor
  • Wojciech Debski, Silicon Radar: 60GHz SiGe BiCMOS MIMO Chip for High-Resolution Radar Sensor
  • Sebastiaan Kersjes, BESI NL: Backend Building Block Development
  • Steffen Kröhnert, Amkor Technology: Packaging Technology, System Integration and Manufacturability
  • Jonas Sing-Pervaiz, RoodMicrotech: Metrology, Characterization, Test Strategy, Reliability and Failure Analysis
  • Ghanshyam Gadhiya, FhG: Automatic Virtual Prototyping of FOWLP in EuroPAT-MASIP
  • Christopher Johnston, Advanced Vacuum: Defect-Free Dicing for Higher Device Reliability

Kindly register to the Webinar using this REGISTRATION LINK. The registrees will be contacted by email for joining instructions.

1st year face-to-face meeting in Lund

The 1st year face-to-face meeting of EuroPAT-MASIP was held in Lund, Sweden on 14-15th of March. The event was hosted by Advanced Vacuum.

Consortium members in the hall of our meeting venue – we were over 40 people in total!

The project is now 1/3 way through and we have spent the first 12 months as planned by concentrating mainly on design, modelling, and simulation related actions. We hope to be able to publish the first results during second half of 2018!

Project presented in SEMICON Europa

Dr. E. Viinikka (Spinverse) and S. Kröhnert (Amkor) with the roll-up of the project

EuroPAT-MASIP partners were present at SEMICON Europa November 14th 2017 in Munich Germany. During the day the project coordinator Steffen Kröhnert (Amkor) gave two short presentations about the project, and several consortium members were present and available for discussion. Looking forward to see you next year as well!

 

 

 

 

 

 

 

 

1st press release of the project published

(To see the release as .pdf please click here)

EuroPAT-MASIP project secures ECSEL funding to bring semiconductor packaging back to Europe

In today’s world, extensive usage of electronic components is at the core of industrial products, ranging from the automotive all the way to the entertainment and defense industries. The specific needs and requirements from the industries have always been one of the strongest technology drivers for advanced electronics packaging. A persistent target is to find new solutions for increased performance, improved form factors and reduced costs. Even though research and development activities in electronics are still in major part done in Europe, the semiconductor packaging related part of the electronics value chain is strongly dominated by countries in Asia.

“EuroPAT-MASIP will consolidate and extend the European leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving various emerging industrial sectors”, tells Steffen Kröhnert, R&D director of Nanium and the Coordinator of the project. “The emerging needs triggered e.g. by automotive sector trends and IoT provide an opportunity to pull back the specific highest added value parts of the electronics value chain back to Europe. The momentum to grasp this opportunity is now, thus it is absolutely great to have ECSEL support for it”, says Kröhnert.

The project develops packages for six pilot products: WLAN front-end IC, silicon photomultiplier, automotive inertial sensor and a camera, 60 GHz radar sensor and a car tyre sensor. In addition, the project develops a wide portfolio of technological building blocks for integration concepts. These include modelling and simulation, 3D MtM and SiP, packaging technologies, materials as well as test strategy and methods. The new equipment include e.g. plasma dicing technology. “The project has the mission to build a key competitive edge to the electronics technology development; We develop new capabilities and demonstrate their match to the future needs of European industries. This accelerates the manufacturing uptake of the new technologies and shorten time-to-market” tells Johanna Anteroinen, project Manager at Spinverse.

The three-year project’s total budget is about 30 M€, with roughly half of it from ECSEL and national funding. Partners from nine European countries cover the semiconductor packaging, assembly and test value chain all the way from foundry, packaging, component tests to system tests till the end user.  www.europat-masip.eu.

About ECSEL JU

The “Electronic Components and Systems for European Leadership” (ECSEL) is a Joint Undertaking established in June 2014 by the European Union Council Regulation No 561/2014. It is  a  public-private partnership  that  will  engage,  from 2014  to  2020,  up  to  1.17  B€  funding  from  the  European  Union’s Horizon 2020 research and innovation programme, combining it with a commensurate amount of  national/ regional  funding  and  participants’  own  contributions  to  leverage  about  5 B€  Research  and  Innovation  investments  in  nanoelectronics,  embedded  and  cyber-physical  systems,  and  system   integration   technologies. The   R&D   actors   are   represented by the associations AENEAS, ARTEMISIA and EPoSS. The ECSEL Joint Undertaking approved funding for 13 new projects totaling to 725 M€ R&D&I effort, receiving financial support from the EU and participating National authorities. The projects are to reinforce smart, sustainable, and inclusive economic growth for Europe, significantly contributing to European competitiveness and job creation. Read more about the ECSEL JU programme.

Project partners:

NANIUM S.A, BESI Austria GmbH, BESI Netherlands BV, EV Group (EVG), Murata Electronics Oy, Pac Tech -Packaging Technologies GmbH, SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG, Valeo Vision Systems (Connaught Electronics Limited), 3DiS Technologies, RoodMicrotec, Sencio, Afore Oy, Micro Analog Systems Oy, Commissariat à l’Energie Atomique Et Aux Energies Alternatives, Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., VTT Technical Research Centre of Finland Ltd, Advanced Vacuum, Packaging SiP, NXP Semiconductors N.V. , Ketek GmbH, Spinverse, Nokian Tyres, InnoSenT, Berliner Nanotest und Design GmbH, AMIC Angewandte Micro-Messtechnik GmbH, Silicon Radar, TexEDA Design GmbH, Elmos Semiconductor AG


More information:

Steffen Kröhnert, Nanium, steffen.kroehnert[at]nanium.com

Satu Ek, Spinverse, satu.ek[at]spinverse.com