EuroSimE 2020: paper and presentation from our partners!

EuroPAT-MASIP participates on EuroSimE 2020 Virtual event on June 6-27th!

A paper “Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
” by Fraunhofer ENAS in co-op. with Murata and Amkor teams is part of the session on Thermo-mechanical simulations for advanced technologies.

For more information about the event, full programme and registration:
https://www.eurosime.org/

Minho students visiting ATEP in February

Having great experts in your team now is an important thing, but so is having them in future: in February 6th, 31 students from University of Minho visited Amkor Technology Portugal (ATEP).

The students were introduced to the state-of-the-art of packaging technology, the projects where ATEP is involved (including EuroPAT-MASIP!) and the project targets.

Thank you for the visit, hopefully we’ll meet again!

Presenting the project in EFECS 2019

EFECS 2019 was organized in 19-21st of November in Helsinki this year, and EuroPAT-MASIP project partners participated from all over the Europe. It was great to meet you all in Finlandia Hall and later in the Helsinki City Hall, especially now that we had the latest results to discuss about from the 2nd review meeting!

Our stand could be found in the Exhibition area, next to a newer ECSEL project Applause whom with we share several partners.

Prototypes and progress shown in the 2nd review meeting

The second review meeting of EuroPAT-MASIP was organized in Brussels in the last week of October 2019, and we were proud to present the progress we have made since the first review! We now have prototypes of 3/6 application pilots, and certain partners have also detected new tools and improvements to their processes. We are very excited to see how this new know-how will affect on semiconductor and MEMS manufacturing business during upcoming years.

We are looking forward to tell more about these prototypes and results in a press release in December, so stay tuned!

A well-deserved dinner after the review meeting – thank you for all AP and TLV owners, WP leaders, reviewers and our great project officer!


EuroPAT-MASIP in ECSEL JU Symposium

Greeting from Bucharest, Romania!

Just like last year, EuroPAT-MASIP project was present at ECSEL JU Symposium 2019 in June 17-18th at Bucharest, Romania. It was once again extremely inspiring to meet so many of you fellow members of the ECS community! In addition to interesting talks and conversations, this year will surely be remembered for its splendid venue – the Palace of the Parliament is genuinely amazing.

EuroPAT-MASIP project members at the Receptions Saloon

More vibes and information about the event:

Smart System Integration (SSI), Barcelona, 9-11th April 2019

Greetings from Barcelona!

M.Sc. Ghanshyam Gadhiya (Fraunhofer ENAS) held a presentation about automated optimization and virtual prototyping of SiP designs. In this research the virtual prototyping approach was used for virtual assessment of FOWLP based automotive inertial sensor, and a complete design assessment was performed automatically. The results demonstrate the capability of this virtual prototyping method.

The full article ‘‘The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs’’ by G. Gadhiya et al. will be published in the conference proceedings of SSI 2019 (Barcelona) later this spring.

Other conferences coming up this spring:

28-31 May 2019: ECTC @ Las Vegas, USA

Wed 29 May 2019, 9-11 AM
Session 37: Interactive Presentations 1
Ayad Ghannam (3DiS Technologies); Birgit Brandstätter (BESI AT); Niek van Haare, Sebastiaan Kersjes (BESI NL); Julian Bravin (EVG); Philippe Meunier (NXP):
Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices

17-18 June 2019: ECSEL JU Symposium @ Bucharest, Romania

EuroPAT-MASIP: Conferences in April 2019

Come to meet EuroPAT-MASIp partners at following events in April:

4th April: IMAPS Microtech 2019 “Power in Packaging” @ UK

10-11th April: SSI 2019 (Smart System Integration) @ Barcelona
EuroPAT-MASIP partners can be met in Test and reliability session on Wednesday 10th of April:

16:50 The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs, Ghanshyam Gadhiya, Fraunhofer Institute for Electronic Nano Systems ENAS