The EuroPAT-MASiP project with 28 partners from all over Europe was completed in August 2021, demonstrating a successful and significant overall outcome. The project, funded by the ECSEL JU and national funding agencies, aimed to reinforce the European semiconductor manufacturing position by focusing on the semiconductor and microelectromechanical systems (MEMS) packaging. The results of the project have an impact on the development of new packaging technologies, production and test equipment, as well as on innovative applications by European electronics, component and system manufacturers. Spinverse prepared the funding application and during the project execution supported the project coordinator on the successful management of the project.
The Smart Systems Integration Conference 2021 conference takes place April 27th to 29th, 2021 as a virtual event. Being one of the organizers, a EuroPAT-MASIP partner Franhofer ENAS invites you all to participate!
The presentations of Smart Systems Integration Conference will take place on three mornings (27.04. – 29.04.) from 9 – 12 a.m. The experts will present their latest findings in the field of Smart Systems along the whole of the value chain, starting from MEMS/NEMS, photonics, micromechanics, microfluidics, printed functionalities through to complete systems and different application scenarios.
EuroPAT-MASIP had its 3rd review meeting on Wednesday this week, thanks for the reviewers for their positive and encouraging feedback! The remaining six months will be busy with the last deliverables and testings, but it definitely looks like the first results will be exploited commercially very soon after the project ends in June 2021. Exciting times!
Now, happy holidays for everyone and even happier new year 2021!
EuroPAT-MASIP team from Fraunhofer ENAS, Besi NL and Amkor has been awarded with the Outstanding Paper Award at ASME 2020 InterPACK Conference (oct 27-28. 2020) for their paper “The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods” .
Congratulations to Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes and Felandorio Fernandes!
EuroPAT-MASIP participates on EuroSimE 2020 Virtual event on June 6-27th! A paper “Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line” by Fraunhofer ENAS in co-op. with Murata and Amkor teams is part of the session on Thermo-mechanical simulations for advanced technologies.
As an ecsel project EuroPAT-MASIP has always participated on Ecsel JU symposium in June. This year’s event will be on wednesday 24th of June, and the event is virtual and free of charge: remember to register here!
EFECS 2019 was organized in 19-21st of November in Helsinki this year, and EuroPAT-MASIP project partners participated from all over the Europe. It was great to meet you all in Finlandia Hall and later in the Helsinki City Hall, especially now that we had the latest results to discuss about from the 2nd review meeting!
Our stand could be found in the Exhibition area, next to a newer ECSEL project Applause whom with we share several partners.