Publications & Events

Publications

Published in: 22nd European Microelectronics and Packaging Conference (EMPC)

EuroPAT-MASIP partners are involved in pre-recorded session on Thermo-mechanical simulations for advanced technologies:

Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line by Ghanshyam Gadhiya et al.