Publications
Published in: 2018 7th Electronic System-Integration Technology Conference (ESTC)
- Gadhiya, G. et al: Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions
- Johnston, C. et al: Defect-Free Dicing for Higher Device Reliability
- Kuisma, H. et al: FO-WLP multi-DOF inertial sensor for automotive applications
- Uhrmann, T. et al: Laser Debonding Enabling Ultra-Thin Fan-Out WLP Devices
Published in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems
- Gadhiya, G. et al: The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs
- Scherbaum, S. et al: Toward improved FOWLP manufacturing by using self-alignment process
Published in: Electronic Components and Technology Conference (ECTC)
- Ghannam, A. et al: Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices
Published in: 22nd European Microelectronics and Packaging Conference (EMPC)
- Gadhiya, G. et al: Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
27-29th October 2020: InterPACK @ Anaheim, California, USA
- The best paper award to “The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods” by Ghanshyam Gadhiya et al.
Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 504-509, March 2021
E. Topal, J. Gluch, A. Clausner, A. Cardoso and E. Zschech, “Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography,”
Upcoming events
- 11-14th October 2021: IMAPS @ San Diego, CA, USA
Past events
- 13-14th June 2017: ECSEL JU Symposium @ Malta
- 20-21st June 2017: European SiPAT Member F2F Meeting @ Berlin, Germany
- 18-20th October 2017: EPoSS annual forum @ Graz, Austria
- 14-17th November 2017: SEMICON Europa @ Munich, Germany
- 19-20th June 2018: ECSEL Symposium @ Brussels, Belgium
- 28-30th August 2018: the ASME 2018 InterPACK @ San Francisco, CA, USA
- Talk by Sven Rzepka on “Thermo-mechanical Reliability of the High-Performance Vehicle Computers Enabling Fully Autonomous Driving”
- 18-21st September 2018: the ESTC @ Dresden, Germany
- Our project will have its own special session under topic “EuroPAT-MASIP – Recent advantages in electronics packaging” on Wednesday 19th afternoon. Please remember to confirm the exact time from the ESTC2018 website!
- 16-17th October 2018: EPoSS Annual forum @ Thessaloniki, Greece
- 13-16th November 2018: Semicon Europe @ Munich, Germany
- 20-22nd November 2018: EFECS 2018 @ Lisbon, Portugal
- 4-6th December 2018: ICT 2018 @ Vienna, Austria
- 4th April 2019: IMAPS Microtech 2019 “Power in Packaging” @ UK
- 10-11th April 2019: Smart Systems Integration @ Barcelona
- EuroPAT-MASIP partners can be met in Test and reliability session (Room 11) on Wednesday 10th of April:
- 16:50 The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs, Ghanshyam Gadhiya, Fraunhofer Institute for Electronic Nano Systems ENAS
- EuroPAT-MASIP partners can be met in Test and reliability session (Room 11) on Wednesday 10th of April:
- 28-31 May 2019: ECTC @ Las Vegas, USA
- Wed 29 May 2019, 9-11 AM, Session 37: Interactive Presentations 1
- Ayad Ghannam (3DiS Technologies); Birgit Brandstätter (BESI AT); Niek van Haare, Sebastiaan Kersjes (BESI NL); Julian Bravin (EVG); Philippe Meunier (NXP):
- Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices
- 17-18 June 2019: ECSEL JU Symposium @ Bucharest, Romania
- Come to meet us at EuroPAT-MASIP booth!
- 16-19 September 2019: EMPC @ Pisa, Italy
- Talk on Thursday 19th in Auditorium: Assessment of FOWLP process dependent wafer warpage using parametric FE study. Ghanshyam Gadhiya, Fraunhofer ENAS.
- 16-17th October 2019: EPoSS annual forum @ San Sebastián, Spain
- 12-15th November 2019: Semicon Europa @ Munich, Germany
- 19-21st November 2019: EFECS @ Helsinki, Finland
- Come to meet us at EuroPAT-MASIP booth in the exhibition!
- 27-29th January 2020: 3D & Systems Summit @ Dresden, Germany
- Meet Ayad Ghannam (from 3DiS) on Session 5: Mobile and IoT on Wednesday 29th.
- 6-8th July 2020: EuroSimE virtual event
- EuroPAT-MASIP partners are involved in pre-recorded session on Thermo-mechanical simulations for advanced technologies:
- Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line by Ghanshyam Gadhiya et al.
- 27-29th October 2020: InterPACK @ Anaheim, California, USA
- EuroPAT-MASIP partners will be presenting: The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods by Ghanshyam Gadhiya et al.
- 25-26th November 2020: EFECS Online event
- 16th February 2021: Advanced Packaging Forum (digital event)
- Presentation from Ghanshyam Gadhiya on topic ” Virtual Prototyping for System-in-Package with Heterogeneous Integration – Enabler for faster Time-to-Market”
- 12-15th April 2021: IMAPS Device Packaging
- Presentation from Anshuma Pathak on topic “Chip Package Bumping on Wafer-level for RDL First Fan-out Wafer” on FO-WLP: TECHNOLOGY & RELIABILITY session