Publications & Events


Published in: 2018 7th Electronic System-Integration Technology Conference (ESTC)

Published in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems

Published in: Electronic Components and Technology Conference (ECTC)

Published in: 22nd European Microelectronics and Packaging Conference (EMPC)

Published in: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

27-29th October 2020: InterPACK @ Anaheim, California, USA

  • The best paper award to “The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods” by Ghanshyam Gadhiya et al.

Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 3, pp. 504-509, March 2021

E. Topal, J. Gluch, A. Clausner, A. Cardoso and E. Zschech, “Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography,”

Upcoming events

  • 11-14th October 2021: IMAPS @ San Diego, CA, USA

Past events

  • 13-14th June 2017: ECSEL JU Symposium @ Malta
  • 20-21st June 2017: European SiPAT Member F2F Meeting @ Berlin, Germany
  • 18-20th October 2017: EPoSS annual forum @ Graz, Austria
  • 14-17th November 2017: SEMICON Europa @ Munich, Germany
  • 19-20th June 2018: ECSEL Symposium @ Brussels, Belgium
  • 28-30th August 2018: the ASME 2018 InterPACK @ San Francisco, CA, USA
    • Talk by Sven Rzepka on “Thermo-mechanical Reliability of the High-Performance Vehicle Computers Enabling Fully Autonomous Driving”
  • 18-21st September 2018: the ESTC @ Dresden, Germany
    • Our project will have its own special session under topic “EuroPAT-MASIP – Recent advantages in electronics packaging” on Wednesday 19th afternoon. Please remember to confirm the exact time from the ESTC2018 website!
  • 16-17th October 2018: EPoSS Annual forum @ Thessaloniki, Greece
  • 13-16th November 2018: Semicon Europe @ Munich, Germany 
  • 20-22nd November 2018: EFECS 2018 @ Lisbon, Portugal
  • 4-6th December 2018: ICT 2018 @ Vienna, Austria
  • 4th April 2019: IMAPS Microtech 2019 “Power in Packaging” @ UK
  • 10-11th April 2019: Smart Systems Integration @ Barcelona
  • 28-31 May 2019: ECTC @ Las Vegas, USA
    • Wed 29 May 2019, 9-11 AM, Session 37: Interactive Presentations 1
    • Ayad Ghannam (3DiS Technologies); Birgit Brandstätter (BESI AT); Niek van Haare, Sebastiaan Kersjes (BESI NL); Julian Bravin (EVG); Philippe Meunier (NXP):
    • Ultra-Thin QFN-Like 3D Package with 3D Integrated Passive Devices
  • 17-18 June 2019: ECSEL JU Symposium @ Bucharest, Romania
    • Come to meet us at EuroPAT-MASIP booth!
  • 16-19 September 2019: EMPC @ Pisa, Italy
    • Talk on Thursday 19th in Auditorium: Assessment of FOWLP process dependent wafer warpage using parametric FE study. Ghanshyam Gadhiya, Fraunhofer ENAS.
  • 16-17th October 2019: EPoSS annual forum @ San Sebastián, Spain
  • 12-15th November 2019: Semicon Europa @ Munich, Germany
  • 19-21st November 2019: EFECS @ Helsinki, Finland
    • Come to meet us at EuroPAT-MASIP booth in the exhibition!
  • 27-29th January 2020: 3D & Systems Summit @ Dresden, Germany
  • 6-8th July 2020: EuroSimE virtual event
    • EuroPAT-MASIP partners are involved in pre-recorded session on Thermo-mechanical simulations for advanced technologies:
    • Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line by Ghanshyam Gadhiya et al.
  • 27-29th October 2020: InterPACK @ Anaheim, California, USA
    • EuroPAT-MASIP partners will be presenting: The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods by Ghanshyam Gadhiya et al.
  • 25-26th November 2020: EFECS Online event
  • 16th February 2021: Advanced Packaging Forum (digital event)
    • Presentation from Ghanshyam Gadhiya on topic ” Virtual Prototyping for System-in-Package with Heterogeneous Integration – Enabler for faster Time-to-Market”
  • 12-15th April 2021: IMAPS Device Packaging
    • Presentation from Anshuma Pathak on topic “Chip Package Bumping on Wafer-level for RDL First Fan-out Wafer” on FO-WLP: TECHNOLOGY & RELIABILITY session