Publications & Events


Published in: 2018 7th Electronic System-Integration Technology Conference (ESTC)

Published in: Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems

Published in: Electronic Components and Technology Conference (ECTC)

Published in: 22nd European Microelectronics and Packaging Conference (EMPC)

  • 16th February 2021: Advanced Packaging Forum (digital event)
    • Presentation from Ghanshyam Gadhiya on topic ” Virtual Prototyping for System-in-Package with Heterogeneous Integration – Enabler for faster Time-to-Market”
  • 12-15th April 2021: IMAPS Device Packaging

Past events