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Reinforcing the European semiconductor industry

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Posted on June 29, 2020 by Hilla Pohjalainen

3rd edition of Handbook of Silicon Based MEMS Materials and Technologies published

The brand-new edition of the Handbook of Silicon Based MEMA materials and technologies was published in spring 2020, and can now be purchased from publisher!

The book includes one chapter (Chapter 33 – Fan-out wafer-level packaging as packaging technology for MEMS) written by EuroPAT-MASIP project members from ATEP, Murata and Fraunhofer IZM.

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This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.
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