EuroPAT-MASIP team from Fraunhofer ENAS, Besi NL and Amkor has been awarded with the Outstanding Paper Award at ASME 2020 InterPACK Conference (oct 27-28. 2020) for their paper “The Systematic study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods” .
Congratulations to Ghanshyam Gadhiya, Sven Rzepka, Thomas Otto, Sebastiaan Kersjes and Felandorio Fernandes!