Skip to content
EuroPAT-MASIP
EuroPAT-MASIP

EuroPAT-MASIP

Reinforcing the European semiconductor industry

  • Home
  • Project
    • Project overview
    • Objectives
  • Partners
  • News
  • Publications & Events
  • Materials
  • Contact
  • Privacy Policy
Posted on November 13, 2017 by Hilla Pohjalainen

Meet EuroPAT-MASIP at SEMICON EUROPA

EuroPAT-MASIP partners are present at SEMICON Europa November 14th to 17th 2017 in Munich Germany.

Say hi to colleagues from Amkor, Advanced Vacuum and Spinverse and discuss the future of electronics packaging!

A sneak preview of EuroPAT MASIP Flyer by Advanced Vacuum for SEMICON EUROPA.

 

CategoriesUncategorized

Post navigation

Previous PostPrevious 1st press release of the project published
Next PostNext Project presented in SEMICON Europa
  • EuroPAT-MASiP project on Electronics Packaging has been successfully completed!
  • The final review over!
  • Smart Systems Integration 2021 in April 27-28
  • Greeting from the 3rd review
  • InterPACK’2020 Outstanding paper award to EuroPAT-MASIP team

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.
  • EuroPAT-MASIP on LinkedIN
Privacy Policy Proudly powered by WordPress