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EuroPAT-MASIP

EuroPAT-MASIP

Reinforcing the European semiconductor industry

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Posted on September 22, 2017 by Hilla Pohjalainen

Newspaper article in Tekniikka ja talous

Tekniikka ja Talous, a Finnish news magazine focusing on technology innovations writes about EuroPAT-MASIP in their issue 29/2017 (published on Friday 22nd of September).

The article (in Finnish) can read on the print version and web page of Tekniikka ja talous.

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This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.

This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking under grant agreement No 737497. This Joint Undertaking receives support from the European Union’s Horizon 2020 research and innovation programme and Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden.
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