The EuroPAT-MASIP project kicked off in Berlin in 12-13th April 2017 with the full consortium present. The first day focused on the project scope, practicalities and work package presentations by the work package leaders. The second day focused on specifics of the work packages and planning the work. The event was hosted by Fraunhofer IZM.
The project will continue for 36 months and aims to reinforce the European semiconductor manufacturing position through focusing in the semiconductor and MEMS packaging ecosystem.